Sr. Design Engineer - Hardware 2 -REQ_2306
Tessolve
Bengaluru, Karnataka, India
Engineering, Information Technology
Tessolve Semiconductors a venture of Hero Electronix, part of $5B Hero Group companies a Design and Test Engineering Service Company providing End to End Solutions from Product Engineering, Software, Hardware, Wireless, Automotive and Embedded Solutions. Currently we are 2300+ employees worldwide.
We are Global Multi- National Company having Engineering and Sales presences in India, Malaysia, Singapore, USA, UK, Europe, and China. Tessolve has strategic and sustainable growth plan to ensure the business stability to our valued customers and to protect the career of our employees even under disturbed Business situations.
About Tessolve: Careers - Tessolve
Areas Of Responsibility
- Leading the design, development, and implementation of high speed boards for servers, including processors, memory, storage, and network interfaces.
- Experience in full HDLC like schematic design, PCB layout,SI-PI, mechanical and software integration.
- Experience in High Speed board design with interfaces like PCIe 5.0,LPDDR4/5, SSD’s,M.2,U.2 NVMe, SATA,CXL,USB,Ethernet. etc
- Understanding customer requirements, translating them into technical specifications, and working with other departments to ensure a robust and scalable solution.
- 5 to 8 years of experience
- Hands on experience in server class of board design with AMD or Intel GPU‘s, with high speed interfaces like PCIe 5.0,LPDDR4/5, SSD’s,M.2,U.2 NVMe, SATA,CXL,USB,Ethernet. etc.
- Hands on experience in Hardware Development Life Cycle like design, bringup, testing and validation of boards, functional testing, trouble shooting, debugging and Failure analysis.
- Experience in at least one complete project starting from the high-level design to the final validation.
- Should be able to independently handle schematic design, design analysis and review coordination with peer designers.
- Mentoring and guiding a team of hardware engineers, providing technical expertise and support, and ensuring team members adhere to industry standards.
- Collaborating with cross function team in managing PCB layout, SI-PI simulations, Software development, mechanical , thermal, silicon IP Validation, BIOS and Driver Development/QA etc. and other stakeholders to ensure a cohesive and efficient system design.
- Experience with relevant design tools like Altium and orcad.
- Hand on experience in using instruments like high speed Oscilloscopes, DMM, electronic loads etc. Should be able to develop the board bring-up plan, be able to identify the test equipment required and execute independently.
- Experience in preparing and reviewing hardware design documentation and issue investigation reports.
- Good Communication and interpersonal skills
At Tessolve, we are committed to fostering a workplace that embraces and celebrates diversity in all its forms. We believe that diverse teams drive innovation, creativity, and success. We are dedicated to creating aninclusive environment where all employees, regardless of their race, color, religion, gender, gender identity or expression, sexual orientation, national origin, genetics, disability, age, or veteran status, feel valued and respected. We believe in fair and equitable treatment for all employees and aim to eliminate any biases or barriers that may hinder personal or professional growth.
About the company
Company website•Semiconductor Manufacturing
Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up, and spec to the product. With 3800+ employees worldwide, Tessolve provides a one-stop shop solution with full-fledged hardware and software capabilities, including its advanced silicon and system testing labs.
Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. Tessolve’s design services include solutions on advanced process nodes with a healthy ecosystem relationship with EDA, IP, and foundries. Our front-end design strengths, integrated with the knowledge from the backend flow, allow Tessolve to catch design flaws early in the cycle, thus reducing expensive re-design costs and risks. We actively invest in the R&D center of excellence initiatives such as 5G, mmWave, Silicon photonics, HSIO, HBM/HPI, system-level test, and others.
Tessolve also offers end-to-end product design services in the embedded domain from concept to manufacturing under an ODM model with application expertise in Avionics, Automotive, Industrial, and Medical segments. Tessolve’s Embedded Engineering services enable customers a faster time-to-market through deep domain expertise, innovative ideas, diverse embedded hardware & software services, and built-in infrastructure with world-class lab facilities.
Tessolve’s clientele includes Tier 1 clients across multiple market segments, 9 of the top 10 semiconductor companies, start-ups, and government entities. We have a global presence with office locations in the United States, India, Singapore, Malaysia, Germany, the United Kingdom, Canada, Japan, Taiwan, Thailand, Philippines, and Test Labs in India, Singapore, Malaysia, Austin, and San Jose.