
Steffen Michael's Vibrometry Insights at Microstructure User Meeting 2026
Today, Steffen Michael is presenting at the Microstructure User Meeting 2026: https://www.polytec.com/de/vibrometrie/microstructure-user-meeting
In his talk on parameter extraction at #waferlevel for #processmonitoring in #semiconductor manufacturing he is giving an overview of how vibrometry can be applied to the characterisation and wafer-level #testing of #MEMS.
He is presenting examples for the identification of MEMS process parameters, including membrane thickness and material stress, as well as for the detection of membrane cracks from measured frequency responses.
We are looking forward to a day of inspiring presentations, interactive discussions, and collaborative networking.
Find more detail on our #MEMS #simulation, design and #test services under www.imms.de/mems or contact Steffen Michael or Ludwig Herzog directly.
In his talk on parameter extraction at #waferlevel for #processmonitoring in #semiconductor manufacturing he is giving an overview of how vibrometry can be applied to the characterisation and wafer-level #testing of #MEMS.
He is presenting examples for the identification of MEMS process parameters, including membrane thickness and material stress, as well as for the detection of membrane cracks from measured frequency responses.
We are looking forward to a day of inspiring presentations, interactive discussions, and collaborative networking.
Find more detail on our #MEMS #simulation, design and #test services under www.imms.de/mems or contact Steffen Michael or Ludwig Herzog directly.
Shared byAri Morgan - 2 months ago
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