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Discover High-Throughput Metallization with Temescal UEFC-5700 System | Populer Platform

Discover High-Throughput Metallization with Temescal UEFC-5700 System

Designed to support the metallization of forty two 150mm wafers per load, the Temescal UEFC-5700 with Auratus is our ultimate high-throughput system for lift-off oriented evaporation. Key features of this system include:

✅ 40% more wafers with no footprint or power consumption increase
✅ Less than 10 mins to 5E-07 Torr
✅ 44,00 L/sec pumping
✅ Significantly less surface area & volume

To learn more about this system, visit our website, or contact our thin film group at [email protected]. https://temescal.ferrotec.com/systems/UEFC-5700/
#semiconductors #semiconductormanufacturing #thinfilmsolutions #thinfilms #FerroTecUSA

Shared byAlex Garcia - A month ago

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